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Aeris materiae sunt optimum scelerisque Conductors, sic possunt dissipare calor efficaciter et apta summus potentia et summus temperatus applications. Aeris-fundatur materiae potest sustinere dura operantes condiciones et amplio diuturnitatem et servitium vitae apparatu. Aeris praebet optimum conductivity, reduces signum attenuatione, et apta summus frequency et summus celeritas circuits.
Aeris-secundum duplex postesque pcbs habere altum mechanica vires, potest sustinere corporalis inpulsa et pressura et idoneam variis ambitus. Potest integrare varietate electronic components in occursum universa eget elit.
Debitum ad effective scelerisque conductivity, aeris-secundum duplex postesque pcbs potest efficaciter tractamus calor in summus potentia applications, reducere component temperatus et crescere reliability. Duplex postesided layout concedit magis components ut posita in minori spatio, idoneam spatium-coactus uber consilio.
Late usus est in DUXERIT Lamps, debitum ad optimum calor dissipatio facultatem, potest extendere ministerium vitae leds. Usus est in vehiculo potestate systems, sensoriis et alia summus potentia applications ad aptet ad vehiculum working environments
In apparatu ut motorcycle controls, inverters, potestatem amplifiers, etc., potest efficaciter tractamus magna amounts of calor.
In radio frequency (RF) et Proin applications, in altum conductivity of aeris-secundum duplex postesque PCBs ensures optimum signum tradenda characteres.
In Smartphones, Tabulettae et alia portable electronic cogitationes pro altilium procuratio et PCB consilio.
Aeris materiae sunt optimum scelerisque Conductors, sic possunt dissipare calor efficaciter et apta summus potentia et summus temperatus applications. Aeris-fundatur materiae potest sustinere dura operantes condiciones et amplio diuturnitatem et servitium vitae apparatu. Aeris praebet optimum conductivity, reduces signum attenuatione, et apta summus frequency et summus celeritas circuits.
Aeris-secundum duplex postesque pcbs habere altum mechanica vires, potest sustinere corporalis inpulsa et pressura et idoneam variis ambitus. Potest integrare varietate electronic components in occursum universa eget elit.
Debitum ad effective scelerisque conductivity, aeris-secundum duplex postesque pcbs potest efficaciter tractamus calor in summus potentia applications, reducere component temperatus et crescere reliability. Duplex postesided layout concedit magis components ut posita in minori spatio, idoneam spatium-coactus uber consilio.
Late usus est in DUXERIT Lamps, debitum ad optimum calor dissipatio facultatem, potest extendere ministerium vitae leds. Usus est in vehiculo potestate systems, sensoriis et alia summus potentia applications ad aptet ad vehiculum working environments
In apparatu ut motorcycle controls, inverters, potestatem amplifiers, etc., potest efficaciter tractamus magna amounts of calor.
In radio frequency (RF) et Proin applications, in altum conductivity of aeris-secundum duplex postesque PCBs ensures optimum signum tradenda characteres.
In Smartphones, Tabulettae et alia portable electronic cogitationes pro altilium procuratio et PCB consilio.
Parameter | Description |
---|---|
Subiecto materia | Aeris-fundatur (aeris subiectum) typically aluminium et aeris core |
Aeris crassitudine | Communis crassitudines 1oz, 2oz, 3oz; typically 1oz (35μm), 2oz (70μm), 3oz (105μm) |
Crassities | Communis crassitudine iugis a 0.8mm ad 2.0mm, customizable ut opus |
Superficiem curatio | Commune Superficiem treatments includit aurum plating, Hasl (calidum Aeris solidatur adtritio), osp (Organic soldererability conservative) |
Minimum vestigium width / spacing | 0,1mm (4mil) - 0.15MM (6mil), fretus consilio et vestibulum processus |
Comitem | Duplex, (II layers) PCB (Fronte & Back layers) |
Maximus | Typically usque ad 450mm x 350mm, customizable usque ad 500mm x 600mm fretus apparatu |
Minimum foraminis magnitudine | 0.2mm (8mil) - 0.3mm (12mil), variat fretus vestibulum capabilities |
Vena portantes facultatem | 1oz aeris potest portare circiter 1a, 2oz aeris potest portare de 2a, 3oz aeris potest portare de 3a |
Imperance Imperium | PCB Imperance Imperium est 50ω ± X% (nam signum et potentia lineae) |
Nulla materiales | Typically F4 (fiberglass epoxy resinae) vel specialioribus materiae ut LATERAMEN, fretus temperatus, frequency et mechanica requisitis |
Temperatus rating | Typice CXX ° C (Ul94v 0 vexillum), summus temperatus applications ut requirere altius ratings ut CLXXX ° C vel CC ° C |
Scelerisque conductivity aeris Core | De scelerisque conductivity typically ranges ex 1.0W / m K ad 2.0W / M · K, fretus aeris basi materia electi |
Aeris electroplating | Aeris plating crassitiem potest vagarentur ab 35μm ad 105μm fretus consilio et applicationem |
Electrica perficientur | Minimum resistentia humilis damnum apta summus frequentia et summus celeritate signo transmissione applications |
Superficiem metam | Lenis plana superficiem melius soldering et reducitur signum damnum et electromagnettic |
Parameter | Description |
---|---|
Subiecto materia | Aeris-fundatur (aeris subiectum) typically aluminium et aeris core |
Aeris crassitudine | Communis crassitudines 1oz, 2oz, 3oz; typically 1oz (35μm), 2oz (70μm), 3oz (105μm) |
Crassities | Communis crassitudine iugis a 0.8mm ad 2.0mm, customizable ut opus |
Superficiem curatio | Commune Superficiem treatments includit aurum plating, Hasl (calidum Aeris solidatur adtritio), osp (Organic soldererability conservative) |
Minimum vestigium width / spacing | 0,1mm (4mil) - 0.15MM (6mil), fretus consilio et vestibulum processus |
Comitem | Duplex, (II layers) PCB (Fronte & Back layers) |
Maximus | Typically usque ad 450mm x 350mm, customizable usque ad 500mm x 600mm fretus apparatu |
Minimum foraminis magnitudine | 0.2mm (8mil) - 0.3mm (12mil), variat fretus vestibulum capabilities |
Vena portantes facultatem | 1oz aeris potest portare circiter 1a, 2oz aeris potest portare de 2a, 3oz aeris potest portare de 3a |
Imperance Imperium | PCB Imperance Imperium est 50ω ± X% (nam signum et potentia lineae) |
Nulla materiales | Typically F4 (fiberglass epoxy resinae) vel specialioribus materiae ut LATERAMEN, fretus temperatus, frequency et mechanica requisitis |
Temperatus rating | Typice CXX ° C (Ul94v 0 vexillum), summus temperatus applications ut requirere altius ratings ut CLXXX ° C vel CC ° C |
Scelerisque conductivity aeris Core | De scelerisque conductivity typically ranges ex 1.0W / m K ad 2.0W / M · K, fretus aeris basi materia electi |
Aeris electroplating | Aeris plating crassitiem potest vagarentur ab 35μm ad 105μm fretus consilio et applicationem |
Electrica perficientur | Minimum resistentia humilis damnum apta summus frequentia et summus celeritate signo transmissione applications |
Superficiem metam | Lenis plana superficiem melius soldering et reducitur signum damnum et electromagnettic |