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Copper materials are excellent thermal conductors, so they can dissipate heat effectively and are suitable for high-power and high-temperature applications. Copper-based materials can withstand harsh working conditions and improve the durability and service life of equipment. Copper provides excellent conductivity, reduces signal attenuation, and is suitable for high-frequency and high-speed circuits.
Copper-based double-sided PCBs have high mechanical strength, can withstand physical shock and pressure, and are suitable for various environments. It can integrate a variety of electronic components to meet complex functional requirements.
Due to effective thermal conductivity, copper-based double-sided PCBs can effectively handle heat in high-power applications, reduce component temperature, and increase reliability. Double-sided layout allows more components to be laid out in a smaller space, suitable for space-constrained product design.
Widely used in LED lamps, due to its excellent heat dissipation ability, it can extend the service life of LEDs. Used in vehicle control systems, sensors and other high-power applications to adapt to vehicle working environments
Used in equipment such as motorcycle controls, inverters, power amplifiers, etc., it can effectively handle large amounts of heat.
In radio frequency (RF) and microwave applications, the high conductivity of copper-based double-sided PCBs ensures excellent signal transmission characteristics.
Used in smartphones, tablets and other portable electronic devices for battery management and PCB design.
Copper materials are excellent thermal conductors, so they can dissipate heat effectively and are suitable for high-power and high-temperature applications. Copper-based materials can withstand harsh working conditions and improve the durability and service life of equipment. Copper provides excellent conductivity, reduces signal attenuation, and is suitable for high-frequency and high-speed circuits.
Copper-based double-sided PCBs have high mechanical strength, can withstand physical shock and pressure, and are suitable for various environments. It can integrate a variety of electronic components to meet complex functional requirements.
Due to effective thermal conductivity, copper-based double-sided PCBs can effectively handle heat in high-power applications, reduce component temperature, and increase reliability. Double-sided layout allows more components to be laid out in a smaller space, suitable for space-constrained product design.
Widely used in LED lamps, due to its excellent heat dissipation ability, it can extend the service life of LEDs. Used in vehicle control systems, sensors and other high-power applications to adapt to vehicle working environments
Used in equipment such as motorcycle controls, inverters, power amplifiers, etc., it can effectively handle large amounts of heat.
In radio frequency (RF) and microwave applications, the high conductivity of copper-based double-sided PCBs ensures excellent signal transmission characteristics.
Used in smartphones, tablets and other portable electronic devices for battery management and PCB design.
Parameter | Description |
---|---|
Substrate Material | Copper-based (Copper substrate), typically aluminum or copper core |
Copper Thickness | Common thicknesses are 1oz, 2oz, 3oz; typically 1oz (35µm), 2oz (70µm), 3oz (105µm) |
Board Thickness | Common thickness ranges from 0.8mm to 2.0mm, customizable as needed |
Surface Treatment | Common surface treatments include Gold Plating, HASL (Hot Air Solder Leveling), OSP (Organic Solderability Preservative) |
Minimum Trace Width/Spacing | 0.1mm (4mil) - 0.15mm (6mil), depending on design and manufacturing process |
Layer Count | Double-sided (2 layers) PCB (Front & Back layers) |
Maximum Size | Typically up to 450mm x 350mm, customizable up to 500mm x 600mm depending on equipment |
Minimum Hole Size | 0.2mm (8mil) - 0.3mm (12mil), varies depending on manufacturing capabilities |
Current Carrying Capacity | 1oz copper can carry approximately 1A, 2oz copper can carry about 2A, 3oz copper can carry about 3A |
Impedance Control | Common PCB impedance control is 50Ω ±10% (for signal and power lines) |
Insulation Material | Typically FR4 (fiberglass epoxy resin) or specialized materials such as ceramics, depending on temperature, frequency, and mechanical requirements |
Temperature Rating | Typically 120°C (UL94V-0 standard), high-temperature applications may require higher ratings such as 180°C or 200°C |
Thermal Conductivity of Copper Core | Thermal conductivity typically ranges from 1.0W/m·K to 2.0W/m·K, depending on the copper base material chosen |
Copper Electroplating | Copper plating thickness can range from 35µm to 105µm depending on the design and application |
Electrical Performance | Low resistance, low loss, suitable for high-frequency and high-speed signal transmission applications |
Surface Finish | Smooth, flat surface for better soldering and reduced signal loss and electromagnetic interference |
Parameter | Description |
---|---|
Substrate Material | Copper-based (Copper substrate), typically aluminum or copper core |
Copper Thickness | Common thicknesses are 1oz, 2oz, 3oz; typically 1oz (35µm), 2oz (70µm), 3oz (105µm) |
Board Thickness | Common thickness ranges from 0.8mm to 2.0mm, customizable as needed |
Surface Treatment | Common surface treatments include Gold Plating, HASL (Hot Air Solder Leveling), OSP (Organic Solderability Preservative) |
Minimum Trace Width/Spacing | 0.1mm (4mil) - 0.15mm (6mil), depending on design and manufacturing process |
Layer Count | Double-sided (2 layers) PCB (Front & Back layers) |
Maximum Size | Typically up to 450mm x 350mm, customizable up to 500mm x 600mm depending on equipment |
Minimum Hole Size | 0.2mm (8mil) - 0.3mm (12mil), varies depending on manufacturing capabilities |
Current Carrying Capacity | 1oz copper can carry approximately 1A, 2oz copper can carry about 2A, 3oz copper can carry about 3A |
Impedance Control | Common PCB impedance control is 50Ω ±10% (for signal and power lines) |
Insulation Material | Typically FR4 (fiberglass epoxy resin) or specialized materials such as ceramics, depending on temperature, frequency, and mechanical requirements |
Temperature Rating | Typically 120°C (UL94V-0 standard), high-temperature applications may require higher ratings such as 180°C or 200°C |
Thermal Conductivity of Copper Core | Thermal conductivity typically ranges from 1.0W/m·K to 2.0W/m·K, depending on the copper base material chosen |
Copper Electroplating | Copper plating thickness can range from 35µm to 105µm depending on the design and application |
Electrical Performance | Low resistance, low loss, suitable for high-frequency and high-speed signal transmission applications |
Surface Finish | Smooth, flat surface for better soldering and reduced signal loss and electromagnetic interference |