SMT patch factory quality requirements for PCBA wave soldering?
With the widespread application of PCB circuit boards in various industries, the demand for small-batch PCB proofing in the trial production stage of finished products is increasing. For welding quality, reliability is crucial, and this requirement should be strictly controlled from the design stage. According to statistics from the US Navy, 40%-60% of the failures of military electronic products are attributed to design problems. The basic link of the welding operation is to heat and melt the solder material, and usually apply flux to the soldered surface to promote the wetting of the solder material to the soldered metal. Practice has proved that the strength and reliability of the solder joint are completely dependent on the good wettability of the solder material to the soldered metal. Therefore, in terms of process selection, high-quality solder material and flux have become key factors that directly affect the wetting effect and cannot be ignored.
The key points of SMT patch factory in the quality control of patch proofing PCBA wave soldering include:
1. Adopting parallel management mechanism in product research and development
In production practice, welding problems caused by PCBA design defects are common. Such defects are difficult to solve only by improving operation and process, and often fall into the dilemma of "congenital deficiency is difficult to make up for later". Therefore, the quality control of wave soldering should start from the PCBA design stage and run through the entire process before delivery and packaging. At the beginning of each new PCBA design, a mutual trust and cooperation mechanism should be established between design, process, production and quality inspection personnel. This means that process, production and quality inspection personnel should intervene in product research and development at an early stage and adopt parallel technical routes. This is the fundamental way to solve welding problems caused by design defects.
2. Establish a strict component solderability management mechanism
The solderability of the metal surface depends on the degree of removal of surface dirt and oxide film and the inherent wettability of the metal. Wave soldering practice shows that maintaining good solderability of component leads is the basis for obtaining high-quality solder joints and a key measure to improve production efficiency. It is often found in production that when the solderability of the welded parts is good, even if there is a deviation in the welding process parameters, a better welding effect can be obtained, that is, the fluctuation of process parameters has little effect on it. On the contrary, it is extremely sensitive to fluctuations in process parameters, the process window is narrow, the operation is difficult, and the welding quality is difficult to stabilize. Therefore, when purchasing components, PCBs, terminals, etc., the provisions of solderability and wetting limit time must be added to the delivery technical conditions to ensure that the solderability of components is appropriate.
XDCPCBA focuses on providing high-quality circuit boards and assembly services for multiple industries such as instrumentation, industrial control, communication equipment, automotive electronics, medical electronics, security monitoring, power appliances, and consumer electronics. In terms of PCB manufacturing, we provide a full range of manufacturing services from 2 to 30 layers, and provide customers with free PCB proofing services for 1-6 layers, helping customers save costs in the early stages of product development and accelerate the R&D process. In addition, we also provide component procurement and one-stop PCB assembly services, from PCB manufacturing, component procurement to assembly testing, full participation, to ensure that each production link meets customer requirements. XDCPCBA is committed to providing customers with high-quality PCB manufacturing and PCBA processing services, and looks forward to working with you to create a better future.
