XDCPCBA

XDCPCBA PCB manufacturing process parameter table

Process Step Process Description Standard Parameters/Requirements
Raw Material Selection Choose suitable PCB substrate materials (e.g., FR4, ceramic, flexible substrates) to meet electrical, thermal, and mechanical performance requirements. FR4: 1.6mm thickness, copper thickness: 1 oz (35μm); Ceramic: 0.8mm, copper thickness: 2 oz.
Copper Clad Processing Bond copper foil to the substrate and use chemical etching to remove unnecessary copper layers, forming the circuit pattern. Copper thickness: 1 oz (35μm); etching accuracy: ±10μm.
Circuit Printing Use photolithography to print the circuit pattern onto the PCB surface, followed by exposure and development. Minimum line width: 0.075mm; minimum spacing: 0.075mm.
Drilling Drill holes on the PCB for component leads or blind holes. Hole diameter: 0.2mm to 6mm; minimum hole spacing: 0.5mm; hole wall accuracy: ±0.1mm.
Gold Plating Perform metal deposition on the PCB's electroplating layer to enhance soldering reliability and corrosion resistance. Gold thickness: 1-3μm; gold plating accuracy: ±0.5μm.
Surface Treatment Apply surface treatment to the PCB, such as tin spraying, hot air leveling, metallization of holes, HASL (Hot Air Solder Leveling), etc. HASL: solder surface flatness ±0.5mm; tin thickness: 5-8μm; plating: 2-4μm.
PCB Drying Dry the PCB to remove residual moisture, preventing humidity from affecting subsequent assembly. Temperature: 100-120℃; time: 1 hour.
Electrical Testing Conduct electrical testing on the PCB to check for short circuits, open circuits, and other electrical issues. Insulation resistance: ≥10^9Ω; test voltage: 500V; pass rate: ≥98%.
Inspection and Adjustment Perform visual inspection and dimensional checks on the PCB to ensure no defects or errors. Visual inspection: no scratches, no cracks; dimensional accuracy: ±0.1mm.
Packaging and Delivery Package and label the compliant PCBs, preparing them for delivery to the customer. Anti-static packaging; size: according to order requirements; packaging: moisture-proof, shock-proof.

XDCPCBA PCB assembly process parameter table

Process Step Process Description Standard Parameters/Requirements
SMT Component Placement Use a pick-and-place machine to mount surface mount devices (SMD) onto the PCB surface, ensuring precise alignment. Placement accuracy: ±0.05mm; minimum component: 0201; placement speed: up to 100,000 components/hour; minimum spacing: 0.2mm.
Solder Paste Printing Use a stencil to print solder paste, ensuring even distribution and avoiding excess or insufficient paste. Solder paste thickness: 0.15-0.2mm; solder paste amount: controlled according to component requirements; solder paste brand: compliant with IPC-610 standards.
Reflow Soldering Use a reflow oven to heat the solder paste, forming a strong connection between the soldered components and the PCB surface. Temperature profile: 150-200℃ (preheat stage), 220-250℃ (reflow stage); soldering time: 30-45 seconds; maximum peak temperature: 260℃.
Wave Soldering Use wave soldering equipment to insert through-hole components (THT) into the PCB and fix them through wave soldering. Temperature profile: 250-270℃; soldering time: 2-4 seconds; wave height: 2-3mm.
Manual Insertion For components that require manual soldering (e.g., high-power components, special packages), perform manual insertion and soldering. Soldering temperature: 250-350℃; soldering time: 5-10 seconds; tools: soldering iron power 50W-70W.
Component Inspection and Testing Use Automated Optical Inspection (AOI) and X-ray inspection to check soldering quality, ensuring no cold solder joints, misalignment, or other issues. AOI accuracy: 0.1mm; X-ray inspection: for BGA, QFN, and other hard-to-observe solder joints.
Functional Testing Conduct functional testing on the assembled PCB to ensure its electrical performance meets design requirements. Test voltage: according to customer design requirements; test items: electrical performance, signal transmission, short circuits, open circuits, etc.
Cleaning and De-soldering Residue Use an ultrasonic cleaning machine to clean the PCB surface, removing solder debris and solder paste residues generated during soldering. Cleaning solution: deionized water or non-contaminating cleaning agent; cleaning time: 10-20 minutes; temperature: 25-30℃.
Packaging and Delivery Package the assembled and tested PCBs to ensure they are not damaged during transportation. Anti-static packaging; packaging form: pallets, foam boxes; transportation conditions: compliant with IPC-1601 transportation
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