-
PCB designWe have a team of senior engineers who are proficient in high-speed circuit design and high-density interconnect technology. With a professional attitude and exquisite skills, we can solve PCB design problems for you. From conceptual design to prototype production, we follow up throughout the entire process to ensure the smooth progress of your project. Whether it's consumer electronics, industrial control, or communication equipment, we can provide customized design services to enhance product stability and reliability. -
PCB layoutFocus on the core aspects of PCB layout and scientifically and reasonably layout components. Accurately plan the route direction, optimize the signal transmission path, effectively reduce electromagnetic interference, and improve circuit performance. While ensuring the implementation of functions, fully consider production processes and create efficient, stable, and easy to produce PCB layout solutions. -
PCB copyingPCB copying, also known as printed circuit board cloning technology
, is a process of reverse analysis of circuit boards through reverse research and development methods, based on the existing physical electronic products and circuit boards. The process aims to 1:1 restore the original product's PCB files, bill of materials (BOM) files, schematic files, and other technical information, as well as PCB screen printing production files, in order to achieve a complete replication of the original circuit board template. -
Decryption of Encrypted Chip（IC Decryption）We can collaborate with a professional chip decryption team, leveraging advanced technology and rich experience, to precisely break through the encryption defense line for various types of chips. Whether it is complex integrated circuit chips or specialized chips applied in different fields, they can efficiently parse internal circuit structures and program codes, providing key support for product upgrades, maintenance, and reverse engineering research, strictly adhering to decryption process specifications and customer information security.
- Metal Core PCBUsing aluminum, magnesium alloy, or copper as the core material, with a thermal conductivity of up to 180-200 W/m · K, it supports rapid heat dissipation from high-power devices such as LED chips and power modules. Adopting insulation lamination technology (such as AlN ceramic substrate), it is suitable for high brightness LED, industrial heating controller (car LED headlight PCB, charging pile power module, laser printer motherboard) and other high heat generating scenarios.
- Double-Layer PCBSupports 24-hour fast shipping, double-sided copper-clad design, supports wiring on both sides, integrates EMI shielding layer, suitable for scenarios such as consumer electronics, frequency converters, smart home repeaters, etc（ Regular through-hole PCB and less than 0.2 square meters, providing free sampling service for 2-6 layers of PCB）
- Multi-Layer PCBSupports fast shipping within 48-96 hours, using multi-layer lamination technology (4-30 layers), paired with high Tg FR-4 substrate (temperature resistance ≥ 150 ℃), supporting HDI micro hole process and blind buried hole design, suitable for high-density scenarios such as 5G base stations, data center server motherboards, etc. Built in heat dissipation through holes and copper pillar reinforcement structure enhance thermal management and mechanical stability.
- HDI PCB (High Density Interconnect PCB)Laser drilling+electroplating filling technology achieves a micro hole diameter of 0.1mm and a spacing of 0.3mm, supporting ultra small packaging such as BGA and CSP. Adopting a layered design (such as Layer+Via Stack) to optimize signal paths, suitable for lightweight scenarios such as smartphones and wearable devices.
- Rigid-Flex PCBCombining rigid layer (FR-4) and flexible layer (PI/Flex), it supports 3D spatial wiring and is suitable for scenarios such as foldable screen phones, drone battery packs, and robot joint connections. By optimizing the bending radius (≥ 3mm) and layered design, both mechanical strength and signal integrity are taken into account.
- High-Frequency PCBUsing PTFE (polytetrafluoroethylene) or Rogers series substrates with low dielectric constant (Df<0.02) and low loss tangent (Tan δ<0.005), it supports GHz level signal transmission and is suitable for high-frequency scenarios such as 5G base stations, RF filters, satellite communication antennas, etc. By optimizing the microstrip line design to reduce signal attenuation and meet the IEC 60150 electromagnetic compatibility standard.
- Custom design supportAccording to customer needs and application scenarios, we provide schematic review, PCB layout optimization, component selection suggestions, and ensure that the design meets high-speed, high-density and special environment requirements.
-
Diversified product typesIncluding single-sided boards, double-sided boards, multi-layer boards, HDI boards, flexible boards and rigid-flexible boards to meet the needs of various fields such as consumer electronics, automobiles, industry, communications, and medical care. -
Advanced Manufacturing ProcessThe use of advanced automation equipment and precision technology ensures accurate routing and aperture, providing full protection for high-speed signal transmission and high-precision applications. -
Comprehensive testing processOnline testing of finished products and final functional testing during the production process ensure that each PCB meets the design indicators and industry standards. -
Fast deliveryRelying on efficient production lines and optimized supply chain management, we ensure delivery and meet customers' urgent project schedules.
-
High-precision SMT assemblyOur SMT assembly uses advanced placement machines, solder paste printing and reflow ovens. This ensures accurate placement of components on high-density multi-layer boards. - THT AssemblyTHT Assembly is ideal for components that require a more secure mechanical connection. We use automated wave soldering and selective soldering techniques to reliably secure through-hole components.
-
Hybrid Technology SolutionsFor PCBs that require both SMT and THT components, we offer hybrid assembly services. This approach leverages the strengths of both technologies to deliver a high-quality, reliable product. -
Quality AssuranceWe adhere to strict industry standards, include multiple inspection stages during the assembly process, and hold certifications such as ISO, UL and RoHS to ensure our components meet global quality and safety requirements.
- Automated Optical Inspection (AOI)High-resolution cameras inspect solder joints and component placements, quickly identifying misalignments, solder bridges, and other visible defects.
- In-Circuit Testing (ICT)This process checks each circuit for continuity, shorts, opens, and component values. ICT is essential for verifying that every component is properly connected and functions correctly.
- Functional TestingCustom test fixtures and software simulate real-world conditions to validate that the PCBA performs its intended functions. This step ensures proper operation across various scenarios and loads.
- X-ray InspectionFor complex boards, especially those with BGAs or other concealed solder joints, X-ray inspection examines the integrity of hidden connections that AOI cannot reach.
- Quality AssuranceEvery component is subjected to thorough testing and verification to ensure compliance with international standards, minimizing the risk of counterfeit or substandard parts.
-
Cost EfficiencyBy leveraging volume discounts and strategic procurement practices, we help optimize costs without compromising on quality, ensuring a competitive edge in your production process. -
Inventory & Lead Time ManagementOur robust supply chain management system enables just-in-time delivery, reducing lead times and ensuring components are available when needed to keep your production on schedule. -
Customized Procurement SolutionsWhether you require standard components or specialized parts for critical applications, we tailor our sourcing strategy to meet your unique specifications and performance requirements.
- Customized ManufacturingWhether it's refining existing designs or creating new products, we adapt our production processes to suit your specific needs.
-
Integrated Supply ChainOur robust component sourcing and inventory management guarantee that production schedules are met without compromising quality. -
Global Standards ComplianceAll products are manufactured in compliance with strict international standards, ensuring safety, performance, and environmental sustainability. -
Flexible Production ScalesWe are equipped to handle everything from low-volume prototypes to mass production, making us an ideal partner for startups and established companies alike.
- Integrated DesignWe provide complete support from schematic design and PCB layout to rapid prototyping, ensuring designs are optimized for manufacturability and performance.
- Component Sourcing and PCB ManufacturingWe leverage a strong supplier network to source high-quality, certified components, reducing the risk of counterfeiting. Advanced manufacturing processes support a variety of PCB types, including single-sided, double-sided, multi-layer, HDI and flexible boards.
- Assembly TechnologyWe offer surface mount technology (SMT) and through-hole technology (THT), as well as hybrid solutions to meet different design requirements. With precision placement machines, reflow ovens and selective soldering, we ensure consistent assembly quality.
- Comprehensive Testing and LogisticsOur PCBAs undergo automated optical inspection (AOI), in-circuit testing (ICT), functional testing, and even X-ray inspection for complex boards. Streamlined logistics ensure fast turnaround and efficient shipping to keep your production schedule on track.
