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FR4 immersion gold double-sided PCB assembly

FR4 immersion gold double-sided PCB is a double-sided circuit board that uses FR4 substrate and processes the surface through immersion gold process to improve the conductivity and wear resistance of the connection points. This PCB is suitable for applications with high requirements for signal stability and durability. It has good electrical performance and corrosion resistance and is widely used in high-end electronic equipment and communications.

XDCPCBA assembly solutions and customization business:
XDCPCBA provides complete assembly services for FR4 immersion gold double-sided PCB, including PCB layout design, component procurement, SMT welding, functional testing and quality inspection. We provide customized solutions according to customer needs to ensure that each circuit board meets the requirements of specific applications and has excellent signal transmission performance and reliability.
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FR4 immersion gold double-sided PCB assembly

Double-sided PCB means that there are conductive patterns on both sides of the circuit board, which can effectively increase the connection density of the circuit and reduce the wiring length per unit area.


Immersion gold is a surface treatment process that usually forms a thin gold layer on the pads and contact points of the PCB to improve welding performance and anti-oxidation ability. Immersion gold treatment can provide better electrical connection and longer service life.


The immersion gold surface can effectively prevent oxidation and wear, ensure the connection stability in long-term use, and is particularly suitable for high-frequency and high-speed applications.


The good conductivity and wettability of the metal pad make the welding process smoother, especially suitable for the welding of SMT (surface mount technology) components.


FR-4 materials and immersion gold surface treatment can effectively reduce signal loss, improve the electrical performance of PCBs, and are suitable for high-frequency applications.


Use PCB design software to complete the circuit diagram and layout to ensure that the wiring of the double-sided circuit is reasonable and the signal


According to the design file, the FR-4 substrate is manufactured, cleaned and dried, and prepared for subsequent processing.


Etching is performed on the surface of the substrate to form the required circuit pattern, and then covered with a thick layer of copper to ensure conductive performance.


A gold layer is generated on the pads and contact points by chemical deposition to complete the gold treatment, ensuring that the welding area has good conductivity and oxidation resistance.


Electrical testing and quality inspection are carried out to ensure that the PCB meets the standard requirements before leaving the factory.


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