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With the rapid development of electronic technology, traditional PCBs can no longer meet the growing demand for high performance. The high-performance multi-layer PCBs we launched use innovative materials and advanced processes to break through the performance boundaries and provide strong power for your next-generation electronic products.
Subverting tradition and leaping performance:
Ultra-low loss substrate: Adopting high-frequency and high-speed special substrates, such as Rogers and Taconic, significantly reduces signal loss and improves transmission rate.
Precision impedance control: Using advanced simulation design and process control technology to achieve precise impedance matching, ensure signal integrity, and meet the needs of high-speed signal transmission.
Efficient heat dissipation design: Built-in heat conduction holes, metal substrates and other heat dissipation structures effectively reduce thermal resistance, improve heat dissipation efficiency, and ensure stable operation of equipment.
High reliability guarantee: Through strict material screening, process control and reliability testing, ensure that the product is still stable and reliable in extreme environments.
Empowering the future, unlimited applications:
5G communication: Provide high-speed and stable signal transmission solutions for 5G base stations, optical modules and other equipment.
Artificial Intelligence: Meet the high bandwidth and low latency requirements of high-performance computing devices such as AI servers and GPUs.
Autonomous Driving: Provide reliable and durable circuit support for key components such as vehicle-mounted radars and sensors.
Internet of Things: Help IoT devices achieve high-speed data transmission and low-power operation.
Choose our high-performance multi-layer PCBs and you will get:
Faster product speed: Break through performance bottlenecks and create a faster and smoother user experience.
Stronger product competitiveness: Leading technology and excellent quality help you seize market opportunities.
Broader application prospects: Empower your products and open up a broader market space.
With the rapid development of electronic technology, traditional PCBs can no longer meet the growing demand for high performance. The high-performance multi-layer PCBs we launched use innovative materials and advanced processes to break through the performance boundaries and provide strong power for your next-generation electronic products.
Subverting tradition and leaping performance:
Ultra-low loss substrate: Adopting high-frequency and high-speed special substrates, such as Rogers and Taconic, significantly reduces signal loss and improves transmission rate.
Precision impedance control: Using advanced simulation design and process control technology to achieve precise impedance matching, ensure signal integrity, and meet the needs of high-speed signal transmission.
Efficient heat dissipation design: Built-in heat conduction holes, metal substrates and other heat dissipation structures effectively reduce thermal resistance, improve heat dissipation efficiency, and ensure stable operation of equipment.
High reliability guarantee: Through strict material screening, process control and reliability testing, ensure that the product is still stable and reliable in extreme environments.
Empowering the future, unlimited applications:
5G communication: Provide high-speed and stable signal transmission solutions for 5G base stations, optical modules and other equipment.
Artificial Intelligence: Meet the high bandwidth and low latency requirements of high-performance computing devices such as AI servers and GPUs.
Autonomous Driving: Provide reliable and durable circuit support for key components such as vehicle-mounted radars and sensors.
Internet of Things: Help IoT devices achieve high-speed data transmission and low-power operation.
Choose our high-performance multi-layer PCBs and you will get:
Faster product speed: Break through performance bottlenecks and create a faster and smoother user experience.
Stronger product competitiveness: Leading technology and excellent quality help you seize market opportunities.
Broader application prospects: Empower your products and open up a broader market space.