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High-performance multi-layer PCB manufacturing

XDCPCBA provides high-performance multi-layer PCB manufacturing and assembly services. We have fast prototyping and fast delivery capabilities. More than ten years of industry experience is our commitment to our customers. We support one-stop PCB solutions. Tell us your demands and we will respond to your needs quickly 24 hours a day.
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high-performance multi-layer PCB

With the rapid development of electronic technology, traditional PCBs can no longer meet the growing demand for high performance. The high-performance multi-layer PCBs we launched use innovative materials and advanced processes to break through the performance boundaries and provide strong power for your next-generation electronic products.


Subverting tradition and leaping performance:


Ultra-low loss substrate: Adopting high-frequency and high-speed special substrates, such as Rogers and Taconic, significantly reduces signal loss and improves transmission rate.


Precision impedance control: Using advanced simulation design and process control technology to achieve precise impedance matching, ensure signal integrity, and meet the needs of high-speed signal transmission.


Efficient heat dissipation design: Built-in heat conduction holes, metal substrates and other heat dissipation structures effectively reduce thermal resistance, improve heat dissipation efficiency, and ensure stable operation of equipment.


High reliability guarantee: Through strict material screening, process control and reliability testing, ensure that the product is still stable and reliable in extreme environments.


Empowering the future, unlimited applications:


5G communication: Provide high-speed and stable signal transmission solutions for 5G base stations, optical modules and other equipment.


Artificial Intelligence: Meet the high bandwidth and low latency requirements of high-performance computing devices such as AI servers and GPUs.


Autonomous Driving: Provide reliable and durable circuit support for key components such as vehicle-mounted radars and sensors.


Internet of Things: Help IoT devices achieve high-speed data transmission and low-power operation.


Choose our high-performance multi-layer PCBs and you will get:


Faster product speed: Break through performance bottlenecks and create a faster and smoother user experience.


Stronger product competitiveness: Leading technology and excellent quality help you seize market opportunities.


Broader application prospects: Empower your products and open up a broader market space.


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