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Multilayer PCB manufacturing and assembly

A multi-layer PCB is a circuit board containing multiple conductive layers, which is connected to the outer circuit through the inner circuit, and uses advanced manufacturing technology to achieve high-density integration. It supports complex circuit design and can provide higher performance and smaller space requirements.
XDCPCBA provides complete multi-layer PCB manufacturing and assembly services, including circuit design optimization, component procurement, SMT, BGA welding, functional testing and other full-process services, aiming to ensure high quality, short-cycle delivery, and meet customers' strict requirements in electrical performance, mechanical strength, reliability, etc. We provide flexible customization services to support various complex designs and production needs of different scales.
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Multilayer PCB manufacturing and assembly

Multiple levels of circuit design can integrate more functions and save space.


: Suitable for high-speed signal transmission, meeting high-frequency and high-speed design requirements.


Through the stacking design, it greatly saves board space and adapts to miniaturization requirements.


The multi-layer design enhances the stability of the PCB and reduces signal interference and electromagnetic noise.


It is widely used in communications, computers, medical, automobiles, consumer electronics and other fields.


It can realize more complex circuit functions and is suitable for complex electronic equipment design.


It provides better signal integrity and reduces signal loss and reflection.


Customize PCBs with different layers, sizes, functions and materials according to customer needs to meet various application scenarios.


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