XDCPCBA

  • Hybrid PCB Assembly

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XDCPCBA is a professional PCB assembly company. We provide PCB manufacturing and assembly services. Advanced testing equipment is our commitment to product quality.​​​​​​​

What is Hybrid PCB Assembly

Hybrid PCB Assembly refers to the use of both through-hole assembly technology (THT) and surface mount technology (SMT) on the same PCB to complete the installation and soldering of components. This assembly method combines the advantages of the two processes, which can meet the design requirements of high density and miniaturization, and support the application of high-power and strong mechanical connection components.

Advantages of Hybrid PCB Assembly

Process flow of Hybrid PCB assembly

  •  Surface mount component assembly (SMT)
Screen printing solder paste: Apply solder paste to the pads to be soldered on the PCB surface through a template.
Component mounting: Use a placement machine to place surface mount components (SMD) on the solder paste-coated pads.
Reflow soldering: The PCB enters the reflow oven, and the solder paste is melted at high temperature to complete the soldering of SMD components.
 
  • Through-hole component assembly (THT)
Insert: Insert through-hole components into the through-holes on the PCB manually or by an automatic inserter.
Wave soldering: The solder is melted and connected to the through-hole component pins by a wave soldering machine to fix the components.
Manual soldering: For complex through-hole components, manual soldering may be required.
 
  •  Inspection and testing
Use AOI (automatic optical inspection) and X-ray inspection to check the welding quality.
Perform electrical and functional tests to ensure that the PCB performance meets the design requirements.

XDCPCBA's HybridPCB Assembly Service

PCB hybrid assembly is an efficient solution to meet the needs of complex electronic products. With strong technical capabilities and rich experience, HXPCB provides customers with high-quality and high-reliability hybrid assembly services and professional PCB hybrid assembly solutions:
1. Our services include one-stop solutions from PCB design, manufacturing to SMT and THT assembly.
2. We are equipped with high-precision SMT placement machines and wave soldering equipment to ensure high-quality hybrid assembly, and customize hybrid assembly processes according to customer needs to meet special components and design requirements.
3. Through AOI, X-ray and functional testing, the welding and performance reliability of each PCB is ensured.

PCBA Application Field

Consumer Electronics
PCBA application in consumer electronics
medical field
PCBA application in the medical field
物联网IOT
PCBA application in the field of Internet of Things
Automotive electronics
PCBA application in automotive electronics
Communication equipment
PCBA is used in communication equipment
Instruments and meters
PCBA is used in instruments and meters

FAQ

  • How to optimize the cost of hybrid PCB assembly?

    Answer: Optimizing the cost of hybrid PCB assembly can start from the following aspects:
     
    Design optimization:
    Reasonably layout SMT and THT areas to reduce the number and complexity of PCB process switching.
    Use common standard components to reduce the cost of customized components.
     
    Process selection:
    For mass production, use automated insertion and wave soldering equipment to improve production efficiency.
    For small-batch production or complex components, combine manual insertion and selective soldering processes to reduce equipment investment.
     
    Material procurement:
    Select base materials and welding materials with balanced performance and cost to reduce waste.
    Quality control:
    Increase the first-time pass rate of production and reduce rework and repair costs.

  • What common defects may occur in hybrid PCB assembly? How to solve it?

    Answer: Common defects and solutions are as follows:
     
    Cold Solder Joint:
    Cause: Insufficient soldering temperature or uneven solder paste coating.
    Solution: Calibrate the soldering temperature curve and optimize the solder paste coating process.
     
    Bridging:
    Reason: Excessive solder paste or insufficient pad design spacing.
    Solution: Adjust the amount of solder paste and pad spacing, and use AOI to check the soldering quality.
     
    Open Lead:
    Reason: The through-hole component pins are not fully in contact with the solder.
    Solution: Ensure the quality of through-hole plating and optimize the wave soldering angle.
     
    Thermal Damage:
    Reason: High-temperature wave soldering causes damage to heat-sensitive components.
    Solution: Use selective soldering or heat shielding design.

  • How to avoid the impact of through-hole soldering on SMT solder joints in hybrid PCB assembly?

    Answer: In hybrid PCB assembly, through-hole soldering may cause thermal damage to SMT components or remelting of solder joints due to high-temperature wave soldering. Solutions include:
     
    Thermal protection design: Add a thermal shield or solder mask to the SMT area during PCB design.
    Sequence optimization: Complete through-hole soldering first, and then perform more heat-sensitive SMT reflow soldering.
    Selective wave soldering: Precisely control the solder wave range to avoid high temperature exposure of solder joints in the SMT area.

  • How to determine the priority process of SMT and THT in hybrid PCB assembly?

    Answer: In general, the assembly order depends on the component type and soldering process:
     
    Priority SMT process
    SMT components are usually mounted on the front side of the PCB and reflow soldered because these components are smaller and have high soldering accuracy.
     
    Subsequent THT process
    After SMT is completed, through-hole components are inserted and wave soldered.
    If there is double-sided SMT, it is necessary to ensure that the insertion of through-hole components will not interfere with the soldering effect of reflow soldering.
    Note: When determining the sequence, it is also necessary to consider the design limitations of the PCB, such as the thermal sensitivity of double-sided SMT soldering.

  • What is hybrid PCB assembly? What application scenarios is it suitable for?

    Answer: Hybrid PCB assembly is an assembly method that uses both surface mount technology (SMT) and through-hole technology (THT) on the same PCB.
     
    Application scenarios:
    Automotive electronics: Need to handle a combination of high power (such as relays) and high density (such as sensor modules).
    Communication equipment: Antenna systems, RF modules, etc. require high-frequency signals and high power support.
    Industrial control: Complex control systems require reliable connections and multi-functional integration.
    Medical equipment: Combination design of high reliability and complex circuits.
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