Revealing the hidden killer of SMT patch processing: electronic parts displacement and X-RAY efficient detection technologySMT patch processing is a process technology composed of multiple processes such as patch, DIP plug-in, and testing. Each process technology has different functions.
Customers tend to choose PCBA one-stop service, what secrets do you need to know?Efficient and convenientOne-stop service integrates various links such as PCB design, component procurement, assembly and testing, which greatly shortens the cycle from product design to mass production.
SMT patch factory quality requirements for PCBA wave soldering?With the widespread application of PCB circuit boards in various industries, the demand for small-batch PCB proofing in the trial production stage of finished products is increasing. For welding quality, reliability is crucial, and this
PCBA: A comprehensive analysis from concept to applicationTable of ContentsWhat is PCBA?Manufacturing process of PCBAKey technologies of PCBAApplication fields of PCBAQuality control of PCBAFuture development trend of PCBAHow to choose a PCBA supplier?FAQ1. What is PCBA?PCBA (Printed Circuit Board A
PCB (Printed Circuit Board) short circuit refers to an electrical connection that occurs between two or more points on the circuit board that should not be connected, resulting in circuit abnormality. There are many reasons for PCB short circuits, and the following are some common reasons:Solder pro
In PCB manufacturing, manufacturability design (DFM) is a crucial task that runs through the entire PCB design process. It aims to ensure that PCBS can be manufactured efficiently and at low cost during the production process, while guaranteeing the reliability and consistency of the products.
In PCB manufacturing, the clarity of character printing directly affects production traceability, assembly efficiency and product reliability.
In PCB manufacturing, the design and fabrication of solder mask Bridges are of vital importance, directly affecting the soldering quality and product reliability.
In PCB manufacturing, the solutions to burrs during drilling can start from optimizing materials, equipment, process parameters, and post-processing, etc.
In the lamination process of PCB manufacturing, pressure control is a key factor affecting the bonding quality, electrical performance and mechanical strength of multi-layer boards.
In PCB manufacturing, the precision requirements for pattern transfer are extremely high, which directly affects the performance and reliability of the circuit board.
During the packaging process of the transparent film three-dimensional packaging machine, if effective moisture-proof measures are not taken, it may lead to the packaged items getting damp and deteriorating, affecting product quality and market competitiveness.
The stability improvement of the transparent film three-dimensional packaging machine requires comprehensive optimization from four dimensions: mechanical structure, electrical control, process adaptation and environmental adaptability.
In the developing process of PCB manufacturing, common problems and their solutions are as follows. The occurrence of these problems may directly affect the accuracy, resolution of the circuit pattern and the electrical performance of the final product
In the exposure process of PCB manufacturing, parameter control is of vital importance, directly affecting the accuracy and quality of the circuit pattern.
The production of inner layer circuits is a core link in PCB manufacturing. Its process mainly includes cutting the board, pre-treatment, lamination, exposure, development, etching, film removal and inner layer inspection, as follows
In PCB manufacturing, the production of outer circuit layers is a crucial step, involving multiple processes such as pretreatment, lamination, exposure, development, etching, film removal, and post-processing.
In PCB (Printed Circuit Board) layout, the reasonable arrangement of components is a key step to improve manufacturability.
In PCB (Printed Circuit Board) assembly, the layout optimization of components is a key step to ensure the performance, reliability, manufacturability and maintainability of the circuit.
In PCB manufacturing, the quality control of the screen printing process is a key link to ensure the final quality and reliability of the product. Screen printing is mainly used to print characters, labels, symbols and solder mask marks on the surface of PCBS. Its quality directly affects the readability, assembly efficiency and subsequent maintenance of PCBS.