XDCPCBA

Through-Hole Technology​​​​​​​

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XDCPCBA is a professional PCB assembly company. We provide PCB manufacturing and assembly services. Advanced testing equipment is our commitment to product quality.​​​​​​​

What is PCB through-hole assembly

PCB through-hole assembly (Through-Hole Technology, THT for short) refers to the assembly method of connecting electronic components to a printed circuit board (PCB) by inserting through holes (i.e., through holes in the PCB). Unlike surface mount (SMT), the pins of through-hole components need to be inserted into the holes of the PCB and then fixed to the circuit board by soldering.

Advantages of PCB through-hole assembly

Basic process flow of PCB through-hole assembly

  • Component Insertion
Insert the pins of through-hole components into pre-punched through-holes on the PCB. The insertion process is usually completed by an automated insertion machine, but it can also be done manually, especially in small batches.
 
  • Soldering
After insertion, the pins of through-hole components need to be fixed to the PCB by soldering. Soldering is usually done by wave soldering or manual soldering:
Wave Soldering: Suitable for mass production, the PCB passes through the molten solder wave, and the component pins and the through-holes of the PCB form solder joints.
Manual Soldering: For complex components or small batches, it is achieved by manual soldering.
 
  • Post-Soldering Inspection
After soldering is completed, check the quality of the solder joints to ensure that there are no problems such as cold soldering, leaking soldering or short circuits. Common inspection methods include automatic optical inspection (AOI) and X-ray inspection.
Check whether the soldered pins are fully in contact with the pads to ensure that there are no defects.
 
  • Testing
After soldering, electrical testing is also required to ensure that the connection of the through-hole components is normal. Testing includes electrical performance testing (for example, testing whether the circuit works properly after power-on) and functional testing.
 
  • Post-processing and cleaning
Clean the PCB surface to remove excess solder, solder paste residue and other contaminants. Part of the through-hole assembly process may also involve applying a protective layer (such as an anti-oxidation coating) to improve the reliability of the board.

PCBA Application Field

Consumer Electronics
PCBA application in consumer electronics
medical field
PCBA application in the medical field
物联网IOT
PCBA application in the field of Internet of Things
Automotive electronics
PCBA application in automotive electronics
Communication equipment
PCBA is used in communication equipment
Instruments and meters
PCBA is used in instruments and meters

HXPCB's through-hole assembly service

HXPCB provides customers with high-quality through-hole assembly services to meet the needs of different industries and applications. We have rich experience and technical capabilities in through-hole assembly. We can provide:

High-precision hole processing
Ensure the precise size and position of the holes, suitable for high-quality assembly requirements.
Wave soldering and manual soldering
Supports wave soldering for mass production and manual soldering of small batches of complex components.
Customized solutions
Provide customized through-hole component assembly solutions for customer specific needs.

FAQ

  • Can through-hole assembly be fully automated?

    Answer:Some processes in through-hole assembly can be automated:
     
    1.Automatic insertion machines: Suitable for simple, standardized component placement.
    2.Wave soldering: Used for mass production to automate the soldering process.
    However, complex components (e.g., irregular shapes or delicate parts) often require manual insertion and soldering.

  • How can soldering defects in through-hole assembly be avoided?

    Answer:Common defects and their solutions:
    1.Cold solder or open solder joints: Adjust soldering temperature to fully melt the solder and clean pads.
    2.Bridging: Control solder volume and pad spacing to prevent short circuits.
    3.Voids: Use high-quality solder and optimize the temperature curve to reduce outgassing.
    4.Component misalignment: Fine-tune placement processes to ensure accurate component positioning.

  • What precautions should be taken when using wave soldering in through-hole assembly?

    Answer:
    1.Pad design: Ensure proper pad size to prevent insufficient or excessive solder.
    2.Temperature control: Maintain appropriate wave soldering temperature and time to avoid component damage.
    3.Flux application: Apply the right amount of flux to improve soldering quality and prevent residue corrosion.
    4.Hole wall plating quality: Ensure uniform copper plating in through-hole walls for reliable electrical connections.

  • What types of components are suitable for through-hole assembly?

     

    Answer:Through-hole assembly is suitable for the following components:
     
    High-power components: Transformers, inductors, and power transistors.
    Mechanically strong components: Connectors, sockets, and switches.
    Heat-dissipating components: High-power LEDs.
    High-reliability components: Control modules for industrial, automotive, and aerospace applications.

  • What is PCB through-hole assembly, and how does it differ from surface-mount technology (SMT)?

     

    Answer:PCB through-hole assembly involves inserting component leads through holes in the PCB and soldering them. The leads penetrate the board, making it ideal for applications requiring high reliability and strong mechanical connections.
     
    Key differences from SMT:
    Through-hole assembly: Leads pass through the PCB and require drilled holes. Wave soldering or manual soldering is used, offering strong mechanical bonds.
    SMT: Components are mounted on the PCB surface, suitable for high-density designs with higher soldering efficiency but lower mechanical strength.
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