High quality multi-layer PCB manufacturing

XDCPCBA provides you with high-performance multi-layer PCB manufacturing and assembly services to meet the needs of various complex electronic products. We use advanced processes and high-quality materials to ensure that each PCB has excellent electrical performance and reliability. Whether it is high-density design, fast signal transmission, or high-frequency application, our multi-layer PCB can provide precise signal transmission and strong thermal management capabilities. Our fast delivery service, customized solutions and strict quality control ensure that each project is delivered on time.

We provide:

Multiple layer options: 4 layers, 6 layers, 8 layers, 10 layers and above to meet different application requirements.

Multiple substrate options: FR-4, high-frequency materials, metal substrates, etc. to meet different performance requirements.

Multiple surface treatments: tin spraying, immersion gold, immersion silver, OSP, etc. to meet different welding and reliability requirements.

Multiple special processes: impedance control, blind buried holes, thick copper, etc. to meet special design requirements.

Our product features:

High-density interconnection: Multi-layer wiring design supports more complex circuit layout, saves space and improves performance.

Excellent electrical performance: Precise interlayer alignment and reliable via technology ensure stable and reliable signal transmission.

Powerful functional integration: Supports advanced processes such as embedded components and blind buried vias to achieve more functional integration.

Wide applicability: Applicable to multiple fields such as communication equipment, computers, consumer electronics, automotive electronics, etc.