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Industrial control motherboards often work in extreme environments such as high temperature, high humidity, and vibration. To this end, we use high-temperature resistant components and moisture-proof and shock-proof designs to ensure that the motherboard can work stably under these harsh conditions. We also pay special attention to heat dissipation design, and optimize the thermal management of the motherboard to ensure stability under high loads and avoid performance degradation or component damage due to excessive temperature.
To meet space restrictions, our industrial control motherboards support high-density integration and use BGA, QFN and other packaging methods to implement more functional modules in a limited space.
The motherboard design focuses on miniaturization and modularization, which is convenient for flexible installation and use in small industrial equipment spaces.
Our industrial control motherboards are customized according to the specific needs of customers, supporting special functions, customized interfaces and specific electrical performance requirements to ensure seamless integration with customers' systems.
Provide comprehensive design support, including schematic design, layout design, signal integrity analysis and electromagnetic compatibility design.
Each industrial control motherboard undergoes strict functional verification and quality control, including automatic optical inspection (AOI), X-ray inspection, solder joint inspection and environmental adaptability test to ensure the high quality of the motherboard. We also provide comprehensive functional tests, including input and output tests, communication tests, voltage tests, load tests, etc., to ensure the functionality and stability of the motherboard.
Industrial control motherboards often work in extreme environments such as high temperature, high humidity, and vibration. To this end, we use high-temperature resistant components and moisture-proof and shock-proof designs to ensure that the motherboard can work stably under these harsh conditions. We also pay special attention to heat dissipation design, and optimize the thermal management of the motherboard to ensure stability under high loads and avoid performance degradation or component damage due to excessive temperature.
To meet space restrictions, our industrial control motherboards support high-density integration and use BGA, QFN and other packaging methods to implement more functional modules in a limited space.
The motherboard design focuses on miniaturization and modularization, which is convenient for flexible installation and use in small industrial equipment spaces.
Our industrial control motherboards are customized according to the specific needs of customers, supporting special functions, customized interfaces and specific electrical performance requirements to ensure seamless integration with customers' systems.
Provide comprehensive design support, including schematic design, layout design, signal integrity analysis and electromagnetic compatibility design.
Each industrial control motherboard undergoes strict functional verification and quality control, including automatic optical inspection (AOI), X-ray inspection, solder joint inspection and environmental adaptability test to ensure the high quality of the motherboard. We also provide comprehensive functional tests, including input and output tests, communication tests, voltage tests, load tests, etc., to ensure the functionality and stability of the motherboard.
Shenzhen Xindachang Technology Co., Ltd. (XDCPCBA) was established in 2016. The company specializes in one-stop services including PCB manufacturing and assembly, component procurement, SMT patch processing and assembly testing. We are also a professional and fast one-stop EMS service provider for multiple varieties of samples and batch production. The company is equipped with German high-precision equipment, fully automatic multi-functional placement machines, reflow soldering, wave soldering, selective wave soldering, X-Ray inspection machines, AOI equipment, etc.
The products have passed UL safety certification, ISO9001 international quality system certification, IATF16949 international automotive electronics quality system certification, and ISO13485 medical device quality system certification. The products involve automotive electronics, medical equipment, industrial control, aerospace, communication equipment and other fields.
SMT production line: 10 fully automatic SMT patch supporting production lines
SMT daily production capacity: more than 12 million points
Inspection equipment: X-RAY detector, first piece tester, AOI automatic optical detector, BGA rework station
The minimum package that can be mounted: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing is ±0.04mm
Shenzhen Xindachang Technology Co., Ltd. (XDCPCBA) was established in 2016. The company specializes in one-stop services including PCB manufacturing and assembly, component procurement, SMT patch processing and assembly testing. We are also a professional and fast one-stop EMS service provider for multiple varieties of samples and batch production. The company is equipped with German high-precision equipment, fully automatic multi-functional placement machines, reflow soldering, wave soldering, selective wave soldering, X-Ray inspection machines, AOI equipment, etc.
The products have passed UL safety certification, ISO9001 international quality system certification, IATF16949 international automotive electronics quality system certification, and ISO13485 medical device quality system certification. The products involve automotive electronics, medical equipment, industrial control, aerospace, communication equipment and other fields.
SMT production line: 10 fully automatic SMT patch supporting production lines
SMT daily production capacity: more than 12 million points
Inspection equipment: X-RAY detector, first piece tester, AOI automatic optical detector, BGA rework station
The minimum package that can be mounted: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing is ±0.04mm