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High-Frequency 5G Smartphone PCB | Millimeter-Wave Support | High-Speed Data Transmission

Designed to meet the stringent requirements of 5G networks, high-frequency 5G smartphone PCBs support millimeter wave technology and seamlessly deliver high-speed data transmission, and are carefully crafted using advanced materials and manufacturing techniques to ensure optimal performance, minimal signal loss, and superior reliability. Whether it’s streaming, online gaming, or other high-bandwidth applications, our PCBs are the backbone that enables next-generation smartphones to achieve superior connectivity and speed.
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High-Frequency 5G Smartphone PCB

Our Product Benefits


  • Excellent Signal Integrity:Minimizes signal loss and improves data transmission quality, ensuring clear communications.

  • Advanced Thermal Management:Uses cutting-edge heat dissipation technology to maintain optimal operating temperature even at high-frequency operation.

  • Rugged Manufacturing:Designed with durability in mind, our PCBs withstand the rigors of daily use, ensuring long-term reliability and performance.

  • Industry Compliant:Manufactured to RoHS and IPC standards, ensuring a safe environment and compliance with global regulations.

Product Specifications

Parameter Specifications
Frequency Range Supports 5G mmWave bands (24 GHz – 90 GHz)
Number of Layers Up to 10 layers
Minimum Trace Width/Spacing 3 mil (0.075 mm)
Via Diameter 0.1 mm
Material High-frequency, low-loss dielectric
Operating Temperature -40°C to 125°C
Compliance RoHS compliant, IPC-7351 certified

Assembly Process

1.Design

Utilizes advanced software for precise layout and design, ensuring minimal interference and optimal signal routing.

2.Manufacturing:

2.1Etching: High-precision etching to accurately define circuit paths.

2.2Drilling: State-of-the-art through-hole drilling to ensure inter-layer connectivity.

2.3Lamination: Carefully layering materials to maintain structural integrity and signal consistency.

3.Component Assembly:

3.1Surface Mount Technology (SMT): High-speed, high-precision placement of components.

3.2Through-Hole Technology (THT): Robust mounting of components that require greater mechanical strength.

3.3Hybrid Technology: Integrate SMT and THT components to meet a variety of application needs.

4.Testing and Inspection:

4.1Automated Optical Inspection (AOI): Ensure component placement accuracy.

4.2In-Circuit Test (ICT): Verify electrical connections and functionality.

4.3Functional Testing: Comprehensive testing to ensure performance under real-world conditions.

Our Services

  • Custom PCB Design: Tailored to specific customer requirements to ensure your vision is realized.

  • Rapid Prototyping: Rapidly complete prototyping to accelerate product development.

  • Mass Production: Scalable manufacturing to meet the needs of high-volume production.

  • PCB Assembly: Provide SMT, THT, and Hybrid Technology assembly services with strict quality control.

  • Testing and Validation: Extensive testing to ensure compliance with industry standards and customer specifications.


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