Product Benefits

1.Ultra-Thin Profile:At just 0.2mm thick, it greatly increases design flexibility while minimizing weight, making it ideal for sleek device designs.

2.High Light Transmittance: Designed for optimal light transmission, it improves the brightness and clarity of OLED displays for stunning visuals.

3.Enhanced Flexibility: Able to bend and conform to a variety of shapes, enabling innovative product designs without sacrificing performance.

4.Excellent Thermal Management: Designed to effectively dissipate heat, ensuring long life and reliable operation without warping or damage.

5.Safety Compliant: Manufactured in accordance with RoHS and IPC standards, ensuring environmentally friendly practices and high-quality output.

Application Areas

• Smartphones: Ideal for modern smartphones that require high-resolution displays and flexible design features.

• Wearables: Ideal for smartwatches and fitness trackers, where space and weight savings are critical.

• Automotive Displays: Enhance in-car navigation and infotainment systems with vivid, flexible display solutions.

• Smart Home Devices: For innovative displays in smart appliances and home automation interfaces.

• Augmented Reality (AR) and Virtual Reality (VR): Enable immersive experiences through curved or foldable display technologies.

  Technical Specifications

  Parameter	Specifications
  PCB Thickness	0.2 mm
  Material	Flexible polyester substrate
  Layer Count	1 layer
  Minimum Trace Width	4 mil (0.1 mm)
  Light Transmittance	Up to 90%
  Operating Temperature	-40°C to 85°C
  Surface Treatment	ENIG (Electroless Nickel Immersion Gold)
  Compliance	RoHS compliant, IPC-6012 compliant

Assembly Process

1.Design Phase:

Use advanced CAD software to perform precise layout and circuit design for OLED applications.

2.Manufacturing:

2.1.Material Preparation: Select high-quality flexible materials that meet performance standards.

2.2.Lithography: Apply photolithography to create fine circuit patterns on flexible substrates.

2.3.Etching: Precision etching to define traces while minimizing material loss.

3.Component Placement:

3.1.Surface Mount Technology (SMT): Use high-speed machinery to accurately place OLED drivers and other components.

3.2.Flexible Component Integration: Ensure components are perfectly aligned for flexible applications.

4.Soldering:

4.1.Reflow Soldering: Utilize advanced reflow technology to ensure strong, reliable connections without damaging the substrate.

4.2.Selective Soldering: For components that require extra strength or special handling.

5.Testing and Inspection:

5.1.Electrical Testing: Ensures that the PCB is properly connected and functional under working conditions.

5.2.Optical Inspection: Checks light transmittance and image quality, which is critical for OLED applications.

5.3.Durability Testing: Conducts flexibility testing to ensure the PCB maintains integrity under bending and folding conditions.

Service Types

• Custom PCB Solutions: Custom designs to meet specific application needs, ensuring a perfect fit for each project.

  
  

• Rapid Prototyping: Rapid prototype completion to facilitate design verification and testing.

  
  

• High-Volume Manufacturing: Scalable manufacturing capabilities to meet the needs of large-scale production.

  
  

• Complete Assembly Services: Providing end-to-end solutions from component sourcing to final assembly.

  
  

• Testing and Quality Assurance: Comprehensive testing protocols to guarantee performance and compliance with industry standards.