Technical Advantages

• High Density Interconnect (HDI): Provides advanced circuit density through microvias and buried vias for compact design without compromising performance.

  
  

• 12-layer stack-up: Provides ample layers for complex routing, ensuring high-speed signal integrity and efficient power delivery.

  
  

• High-speed signal transmission: Optimized for minimal signal loss and impedance matching, ideal for high-bandwidth applications.

  
  

• Heat dissipation: Thermal vias and advanced materials are used to maintain stable operating temperature during intensive use.

  
  

• Rugged manufacturing: Manufactured with high-reliability materials and manufacturing processes to ensure durability and long-term performance.

  
  

• Industry-compliant: Manufactured in accordance with IPC and UL standards to ensure safety and quality.

Technical specifications

Applications

1.Tablets: Designed for high-performance tablets that require fast data processing and high-speed connectivity.

2.Smartphones: For advanced smartphones with demanding processing needs.

3.High-performance computing devices: Ideal for devices that require dense circuits and high-speed signal transmission.

4.Embedded systems: Enhance the performance of systems that require compact, high-density PCBs.

5.IoT Devices: Support IoT devices with complex circuit requirements.

PCB Services

• Custom PCB Design:

Tailor-made solutions to meet customer-specific requirements for layer count, trace width, and signal routing.

• Rapid Prototyping:

Fast turnaround HDI PCB prototypes to accelerate development cycles.

• High-Volume Production

Scalable manufacturing to meet mass production needs with consistent quality.

• Complete Assembly Services

End-to-end solutions including component sourcing, assembly, and testing.

• Testing and Validation

Comprehensive testing services to ensure compliance with industry standards and customer specifications.