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We provide a full range of customized services, support customer-designed assembly solutions, and provide personalized component selection, functional testing and assembly services according to customer needs.
Provide component procurement services to ensure that customers obtain the best quality and most cost-effective components.
We can handle both small-batch prototype production and large-scale production, and flexibly adapt to the needs of different order quantities.
High-speed patch equipment and automated production lines ensure the efficiency and accuracy of large-volume computer motherboard assembly, and can quickly respond to customers' urgent order needs and provide fast turnaround services.
Capable of handling micro components as small as 0.2mm pitch, adapting to the needs of modern computer motherboards for miniaturization and high performance, for BGA and other precision components, using precise optical alignment and X-ray detection technology to ensure solder joint quality and avoid cold soldering or short circuit problems.
We perform a full range of quality control during the production process, including AOI (automatic optical inspection), X-ray inspection, functional testing, etc., to ensure that the soldering quality, signal integrity and functionality of each motherboard meet international standards.
All production processes comply with RoHS environmental protection requirements, and all components and materials used comply with EU environmental regulations to ensure the environmental compliance of products and adapt to the global market.
We provide a full range of customized services, support customer-designed assembly solutions, and provide personalized component selection, functional testing and assembly services according to customer needs.
Provide component procurement services to ensure that customers obtain the best quality and most cost-effective components.
We can handle both small-batch prototype production and large-scale production, and flexibly adapt to the needs of different order quantities.
High-speed patch equipment and automated production lines ensure the efficiency and accuracy of large-volume computer motherboard assembly, and can quickly respond to customers' urgent order needs and provide fast turnaround services.
Capable of handling micro components as small as 0.2mm pitch, adapting to the needs of modern computer motherboards for miniaturization and high performance, for BGA and other precision components, using precise optical alignment and X-ray detection technology to ensure solder joint quality and avoid cold soldering or short circuit problems.
We perform a full range of quality control during the production process, including AOI (automatic optical inspection), X-ray inspection, functional testing, etc., to ensure that the soldering quality, signal integrity and functionality of each motherboard meet international standards.
All production processes comply with RoHS environmental protection requirements, and all components and materials used comply with EU environmental regulations to ensure the environmental compliance of products and adapt to the global market.