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Material Excellence: Utilizes high-performance ceramic-filled substrate for enhanced thermal stability and vibration resistance, ideal for extreme environments.
Wide Temperature Range: Operates consistently in temperatures from -40°C to 125°C, ensuring reliability in both freezing and high-temperature conditions.
Robust Protection: Features an IP67 rating, perfect for withstanding harsh weather and industrial conditions.
Signal Integrity: Optimized PCB layout and shielding minimize signal interference, ensuring stable wireless control.
Modular Design: Supports expansion of various functional modules such as GNSS, radio, IMU, and sensors for easy system integration and upgrades.
High-Quality Manufacturing: Employing advanced SMT processes and stringent quality control ensures product reliability and longevity.
Parameter | Specifications |
---|---|
PCB Thickness | 1.6 mm |
Minimum Via Diameter | 0.1 mm |
Minimum Trace Width/Spacing | 3 mil (0.075 mm) |
Layers | 4 layers |
Substrate Material | Ceramic-filled substrate |
Substrate Thickness | High-precision manufacturing, uniform thickness |
Impedance Control | Strict impedance control for high-frequency signal integrity |
SMT Process
High-precision surface-mount technology ensures reliable and stable component assembly.
Soldering Quality
Lead-free solder is used, with uniform solder joints and no issues such as soldering defects or insufficient solder.
Testing Procedures
Undergoes rigorous environmental and functional testing to ensure every PCB meets high standards before delivery.
This IP67 Industrial Grade Drone PCB enhances the performance and stability of drones through its robust structure and high-precision manufacturing, offering a powerful control core for industrial drone applications.
Material Excellence: Utilizes high-performance ceramic-filled substrate for enhanced thermal stability and vibration resistance, ideal for extreme environments.
Wide Temperature Range: Operates consistently in temperatures from -40°C to 125°C, ensuring reliability in both freezing and high-temperature conditions.
Robust Protection: Features an IP67 rating, perfect for withstanding harsh weather and industrial conditions.
Signal Integrity: Optimized PCB layout and shielding minimize signal interference, ensuring stable wireless control.
Modular Design: Supports expansion of various functional modules such as GNSS, radio, IMU, and sensors for easy system integration and upgrades.
High-Quality Manufacturing: Employing advanced SMT processes and stringent quality control ensures product reliability and longevity.
Parameter | Specifications |
---|---|
PCB Thickness | 1.6 mm |
Minimum Via Diameter | 0.1 mm |
Minimum Trace Width/Spacing | 3 mil (0.075 mm) |
Layers | 4 layers |
Substrate Material | Ceramic-filled substrate |
Substrate Thickness | High-precision manufacturing, uniform thickness |
Impedance Control | Strict impedance control for high-frequency signal integrity |
SMT Process
High-precision surface-mount technology ensures reliable and stable component assembly.
Soldering Quality
Lead-free solder is used, with uniform solder joints and no issues such as soldering defects or insufficient solder.
Testing Procedures
Undergoes rigorous environmental and functional testing to ensure every PCB meets high standards before delivery.
This IP67 Industrial Grade Drone PCB enhances the performance and stability of drones through its robust structure and high-precision manufacturing, offering a powerful control core for industrial drone applications.