XDCPCBA is a world-leading supplier of metal substrate solutions, focusing on the research and development and production of copper substrates (Copper Clad Laminate, CCL), aluminum substrates and composite metal substrates, combined with high-precision PCB assembly capabilities, to provide one-stop services for high-power, heat-sensitive electronic devices. The company has 20 years of industry experience, equipped with advanced processes such as vacuum pressing, laser slotting, lead-free tin spraying, etc., supporting copper layer thickness 1-10OZ (35-350μm), thermal resistance as low as 0.3℃·in⊃2;/W, meeting high heat dissipation demand scenarios such as LED lighting, power modules, automotive electronics, and medical equipment.1. Core technical advantages of copper substrates 1. Material and structural innovation High thermal conductivity material**: Using 94HB/94VO copper clad laminates, combined with ceramic filling technology, the thermal conductivity is increased to 2.5W/m·K, and the local buried copper block/copper column design can increase the heat dissipation efficiency by 50%.Double-sided metal layer process: supports DBC (direct copper deposition)/AMB (active metal brazing) process to achieve high-strength bonding between copper layer and ceramic substrate, suitable for high-power equipment such as IGBT modules and electric welders.Ultra-thin and multi-layer design: can produce ultra-thin copper substrates with a thickness of 0.4-8.5mm, and 2-6 layers of mixed structure (rigid layer + metal layer) to meet the needs of miniaturized equipment.2. Precision manufacturing process Line accuracy: minimum line width/line spacing 4mil/4mil, through-hole aperture 0.3mm, support high-density layout.Surface treatment: Chemical immersion gold (ENIG) thickness 0.05-0.1μm, nickel layer ≥3μm, to ensure solderability and oxidation resistance; lead-free tin spraying (HASL) thickness 3-5μm, suitable for wave soldering process.Impedance control: differential impedance tolerance ±10%, support 50Ω/100Ω standard impedance, meet the needs of high-speed signal transmission.3. **Reliability verification** Environmental testing: passed hot and cold shock (-40℃~+125℃, 500 cycles), damp heat test (85℃/85%RH, 1000 hours) and salt spray test (5% NaCl, 96 hours).Mechanical properties: pad peel strength>1.5N/mm, thermal cycle test (1000 times, ΔT=100℃) without delamination.Environmental certification: complies with RoHS and REACH standards, passed UL94 V-0 flame retardant certification.2. PCB assembly service capabilities 1. SMT/DIP mixed assembly technology High-precision mounting: 01005 component mounting accuracy ±0.03mm, BGA/CSP welding yield>99.8% (0.4mm pitch).Complex component processing: supports dense-foot QFP (0.5mm pitch), connector and shielding cover assembly, and provides BGA rework and red glue process.2. Testing and certification Full-process testing: AOI full inspection (0.8mil resolution) + flying probe test, short circuit/open circuit detection rate 100%.Functional testing: ATE automatic test system supports functional verification of power modules, LED driver boards, etc. Compliance assurance: Passed CE/UL certification, providing RoHS compliance declaration and material composition report.3. Value-added services DFM manufacturability analysis: Provide thermal simulation, impedance calculation and solderability optimization suggestions.Material management: Support JIT supply chain management, stagnant material processing and original channel purchasing.Customized packaging: anti-static vacuum packaging, moisture-proof treatment and logistics tracking services.III. Industry applications and typical cases 1. LED lighting field High-power LED driver board: 6OZ thick copper layer design, support 50W or more LED module heat dissipation, has served brands such as Osram and Philips.Street lamp heat dissipation substrate: double-sided copper layer structure, thermal resistance 0.5℃·in⊃2;/W, ensuring long-term stable operation under -40℃~+85℃ environment.2. Power module field Server power copper substrate: 10OZ copper layer + buried copper column design, meet 200A high current demand, passed UL60950 safety certification.On-board charger (OBC): integrated heat dissipation copper block and shielding layer, support 12-800V wide voltage input, adapted to new energy vehicle platform.3. Automotive electronics field Motor controller: metal-based heat dissipation substrate, support 120℃ long-term operation, passed IATF 16949 certification, and delivered in batches to customers such as Bosch and Continental.LED car light driver board: ultra-thin copper substrate (0.6mm) + waterproof coating design, meet IP67 protection level.4. Industrial equipment field Inverter heat dissipation substrate: 8OZ copper layer + ceramic filling, suitable for industrial motor control above 100kW, has been applied to Siemens and ABB equipment.Electric welding machine control board: DBC process copper substrate, temperature resistance up to 200℃, support 300A welding current.IV. Service value and customer commitment 1. Quick response mechanism -Free proofing: Regular PCB 2-6 layers provide free samples, 3-day delivery; multi-layer board proofing starts from 5 days.Extremely fast mass production: small batch 3-5 days, monthly production capacity 50,000 square feet; support JIT delivery, urgent orders can be expedited within 48 hours.2. Cost optimization plan Tiered quotation: 1-5㎡ enjoy 10% off, 5-10㎡ enjoy 15% off, 10+㎡ enjoy 20% off.Material utilization rate: optimize the layout algorithm, the highest utilization rate reaches 90%, reducing the customer's raw material cost.3. Global service network Technical support: Chinese and English technical documents + localized engineer on-site service.After-sales service: provide 1-year warranty, 7×24 hours fault response, 100% return and replacement of defective products.V. Corporate strength and development vision XDCPCBA has multiple certifications such as ISO 9001, IATF 16949, UL, etc. The R&D team accounts for 20%, and 8% of annual revenue is invested in technological innovation. The company has built a digital factory, and the whole production process traceability is achieved through the MES system, and the product yield is stable at more than 99.6%. In the future, XDCPCBA will continue to deepen the field of metal substrates, promote the application of new semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN), and strive to become a global leader in high-power electronic cooling solutions.
