Views: 0 Author: Site Editor Publish Time: 2025-01-22 Origin: Site
How to prevent PCB deformation and short circuit during wave soldering?

During wave soldering, preventing PCB deformation and short circuit is the key to ensure soldering quality and product reliability. Here are some specific preventive measures:
I. Measures to prevent PCB deformation
1. Select high-quality materials: • Select PCB materials with high Tg value (glass transition temperature) to enhance its ability to resist deformation. • Appropriately increase the thickness of PCB to enhance its structural strength and prevent deformation due to thermal expansion and contraction at high temperature.
2. Optimize design and layout: • Ensure that components are evenly distributed to avoid the formation of local thermal stress concentration areas on the PCB. • In double-sided PCB design, the copper foil reserved area should be as balanced as possible to reduce deformation caused by uneven thermal expansion and contraction.
3. Control welding temperature: • Reduce the temperature of reflow soldering and wave soldering to reduce deformation caused by thermal expansion and contraction. • Adjust the heating and cooling speed so that the PCB can be evenly heated and cooled during the soldering process.
4. Use auxiliary tools: • Use auxiliary tools such as oven trays to stabilize the PCB and reduce its deformation during the soldering process. • For large or easily deformed PCBs, pre-bake treatment can be performed before soldering to release some stress.
5. Keep the environment stable: • Maintain the temperature and humidity of the manufacturing environment to reduce the impact of temperature differences and humidity changes on the PCB.
II. Measures to prevent short circuits in wave soldering
1. Check the direction of the board: • Ensure that the direction of the board is correct to avoid tinning (short circuit) problems caused by incorrect direction.
2. Choose high-quality soldering materials: • Use tin bars with high tin content and few impurities to reduce the impact of impurities during the soldering process. • Choose highly active flux to promote the wetting of the solder material to the metal being soldered.
3. Control soldering parameters: • Control the temperature of the tin furnace within an appropriate range (such as around 265 degrees) and monitor the peak temperature with a thermometer. • Adjust the speed of the conveyor belt or the preheating temperature to ensure that the PCB can reach the required temperature during the soldering process. • Avoid soldering too fast to reduce the problem of solder joints caused by uneven temperature.
4. Design a reasonable solder dam: • Set up solder dams between the pads of the circuit board to prevent the solder paste from connecting during printing. • Ensure that the solder dam/bridge will not be damaged or fall off during the production of the finished product.
5. Control the height of the tin material and the concentration of FLUX: • Control the height of the tin to be appropriate to avoid excessive tin material causing the original part to eat too much tin and be too thick. • Ensure that the specific gravity and concentration of FLUX (flux) are within the range specified by the manufacturer.
6. Keep the PCB and parts clean: • Ensure that the PCB board is clean and uncontaminated, and avoid other items covering the solder surface. • Ensure that there is enough distance between the parts and that there is no contact between them.
7. Optimize the wave soldering track angle: • Adjust the wave soldering track angle to an appropriate range to avoid the problem of tinning caused by a too flat track.
In summary, by selecting high-quality materials, optimizing design and layout, controlling welding temperature, using auxiliary tools, maintaining a stable environment, strictly controlling welding parameters and designing reasonable solder dams, the deformation and short circuit problems of PCB during wave soldering can be effectively prevented. At the same time, keeping the PCB and parts clean and optimizing the wave soldering track angle are also important measures to prevent short circuits.
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