Revealing the working principle of SMT placement machine and the advantages of SMT patch processing
Working principle of SMT placement machine
SMT placement machine is a special equipment for surface assembly technology (Surface Mount Technology, referred to as SMT), also known as "patch machine" or "surface mounting system". Its working principle can be summarized as four core steps of "adsorption-displacement-positioning-mounting":
Adsorption: The placement machine uses the vacuum suction nozzle on its placement head to adsorb components from the component feeder at the material picking position.
Displacement: The placement head is installed on the turret, and the adsorbed components are moved from the material picking position to the patch position (180 degrees from the material picking position) through the rotation of the turret.
Positioning: During the movement process, the position and direction of the component are adjusted through the machine vision centering detection device to ensure that the component can be accurately positioned at the patch position.
Mounting: Finally, the placement head mounts the adjusted components to the specified pad position of the PCB board.
In addition, SMT placement machines also have the following technical features:
High precision: The placement accuracy is usually required to be within ±0.1mm, and the mechanical system and control system of the equipment need to have high precision and high stability.
High speed: Multi-head placement machines can significantly improve the overall placement speed and production efficiency by running in parallel.
Flexibility: It can adapt to the placement requirements of PCB boards and components of different specifications and types.
Advantages of SMT patch processing
Compared with traditional through-hole insertion technology, SMT patch processing has significant advantages:
High reliability: The use of sheet components has high reliability, small size, light weight and strong shock resistance.
Automated production, high placement reliability, generally less than 0.001% solder joint defect rate.
Small size and light weight: The volume of SMT patch components is only about 1/10 of that of traditional plug-in components, and the weight is only 10% of that of traditional plug-in components.
Usually, the use of SMT technology can reduce the volume of electronic products by 40%-60% and reduce the weight by 60%-80%.
Good high-frequency characteristics:
The chip components are firmly installed, usually without leads or with short leads, which reduces the influence of parasitic inductance and parasitic capacitance.
It reduces electromagnetic and radio frequency interference and improves the high-frequency characteristics of the circuit.
Improve productivity:
The automatic chip mounter uses a vacuum nozzle to pick up and place components. The vacuum nozzle is smaller than the component shape, which increases the installation density.
Achieve fully automated production and improve production efficiency.
Reducing costs:
Reducing the area used for printed circuit boards is 1/12 of through-hole technology. If CSP installation is used, its area will be greatly reduced.
The number of holes drilled on the printed circuit board is reduced, saving rework costs.
Due to the improvement of frequency characteristics, the cost of circuit debugging is reduced.
The chip components are small in size and light in weight, which reduces packaging, transportation and warehousing costs.
The use of SMT chip processing technology can save materials, energy, equipment, manpower, time, etc., and reduce costs by 30%~50%.
In summary, SMT placement machines have become indispensable important equipment and technology in the field of modern electronic manufacturing with their high-precision, high-speed, and highly flexible working principles, as well as the significant advantages of SMT patch processing in terms of reliability, volume, weight, high-frequency characteristics, productivity, and cost.
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