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In today's rapidly developing electronics industry, high power density PCBs have become key components for efficient and compact power electronic devices. We design and manufacture high-quality high power density PCBs to provide excellent performance and reliability for your applications.
Features of our high power density PCB products:
Advanced material selection: Adopt high thermal conductivity, low loss substrate materials such as ceramics, metal substrates and special resins to ensure excellent heat dissipation and electrical performance.
Precision manufacturing process: Use advanced laser drilling, precision etching and electroplating technology to achieve fine lines and tiny apertures to meet high-density wiring and heat dissipation requirements.
Optimized thermal management design: Through technologies such as embedded heat pipes, heat dissipation copper blocks and special coatings, thermal resistance is effectively reduced, heat dissipation efficiency is improved, and stable operation of equipment is ensured.
Strict quality control: From raw materials to finished products, each link undergoes strict quality inspection to ensure that the products meet international standards and customer requirements.
Application areas of our high power density PCB products:
New energy: photovoltaic inverters, wind power converters, electric vehicle charging piles, etc.
Industrial control: servo drives, frequency converters, industrial power supplies, etc.
Communication equipment: 5G base stations, radar systems, high-speed network equipment, etc.
Automotive electronics: on-board chargers, motor controllers, battery management systems, etc.
In today's rapidly developing electronics industry, high power density PCBs have become key components for efficient and compact power electronic devices. We design and manufacture high-quality high power density PCBs to provide excellent performance and reliability for your applications.
Features of our high power density PCB products:
Advanced material selection: Adopt high thermal conductivity, low loss substrate materials such as ceramics, metal substrates and special resins to ensure excellent heat dissipation and electrical performance.
Precision manufacturing process: Use advanced laser drilling, precision etching and electroplating technology to achieve fine lines and tiny apertures to meet high-density wiring and heat dissipation requirements.
Optimized thermal management design: Through technologies such as embedded heat pipes, heat dissipation copper blocks and special coatings, thermal resistance is effectively reduced, heat dissipation efficiency is improved, and stable operation of equipment is ensured.
Strict quality control: From raw materials to finished products, each link undergoes strict quality inspection to ensure that the products meet international standards and customer requirements.
Application areas of our high power density PCB products:
New energy: photovoltaic inverters, wind power converters, electric vehicle charging piles, etc.
Industrial control: servo drives, frequency converters, industrial power supplies, etc.
Communication equipment: 5G base stations, radar systems, high-speed network equipment, etc.
Automotive electronics: on-board chargers, motor controllers, battery management systems, etc.