Advantages of Flexible Folding Drone PCB
1.Unmatched Flexibility & Durability: Engineered with a 0.2mm ultra-thin polyimide substrate, this PCB withstands up to 200,000 bending cycles, ensuring long-term reliability in foldable drone systems.
2.Dynamic Impedance Control: Patented impedance control technology ensures signal integrity remains within ±5% during bending, providing stable wireless communication and control.
3.Lightweight & Compact Design: Ultra-thin and lightweight, this PCB is perfect for integrating into foldable drone frames without adding bulk.
4.Modular Architecture: Supports seamless integration of GNSS, radio, IMU, and sensors, enabling customizable functionality for diverse drone applications.
5.High Signal Integrity: Optimized PCB layout and shielding reduce electromagnetic interference (EMI), ensuring stable performance in noisy environments.
6.Extreme Temperature Resistance: Operates reliably in temperatures from -40°C to 125°C, making it suitable for use in harsh outdoor and industrial environments.
Technical Specifications
| Parameter | Specifications |
| PCB Thickness | 0.2 mm (Ultra-Thin Polyimide Substrate) |
| Bending Cycles | 200,000 cycles |
| Substrate Material | Polyimide (Flexible and High-Temperature Resistant) |
| Layers | 4 layers |
| Minimum Via Diameter | 0.1 mm |
| Minimum Trace Width/Spacing | 3 mil (0.075 mm) |
| Dynamic Impedance Control | ±5% |
| Operating Temperature | -40°C to 125°C |
| Bending Radius | Up to 5 mm |
Assembly Details
SMT process: using high-precision surface mount technology (SMT), manual assembly when necessary, etc.
Welding quality: using lead-free solder, uniform solder joints, no defects such as solder joint bridging or insufficient solder.
Testing procedures: Each PCB undergoes rigorous mechanical bending tests, thermal cycles, and functional tests,
