Flexible PCBs (FPCBs) are integral to modern electronics, enabling compact, lightweight designs in applications like wearables, automotive displays, and medical devices. However, their ability to withstand repeated bending without electrical or mechanical failure is critical to their functionality. Bend reliability testing evaluates how FPCBs perform under dynamic and static stress, identifying design flaws or material limitations early in development. Below are key aspects of testing methodologies, failure modes, and mitigation strategies for enhancing FPCB durability.