Servers demand PCBs capable of handling high-speed data transmission, low latency, and signal integrity across multi-gigabit interfaces like PCIe, Ethernet, and DDR memory buses. As data centers scale to support AI, cloud computing, and 5G workloads, PCB manufacturers must optimize designs to minimize crosstalk, impedance mismatches, and electromagnetic interference (EMI). This article explores advanced techniques for high-speed signal processing in server PCBs, focusing on impedance control, layer stackup optimization, and EMI mitigation strategies.